Job Description

Sr. Electronics Packaging Engineer

US Citizen: Security Clearance: Applicants selected for this position will be required to obtain and maintain a U.S. Government security clearance.

Contract 6-12+ months 40 hours weekly

Candidate will be expected to be on site as needed for the project. Hybrid as current model, 2/3 days on site.

Client is seeking a senior engineer for a role focused on electronics packaging. Specific responsibilities include: - Perform mechanical design and development associated with the physical arrangement of electronic circuits including assembly design, analysis, build, test, and documentation support -

Requires candidate to have "diel level packaging experience" Execute the design, tolerance analysis, evaluation, or failure analysis of assigned projects using mechanical design principles - Drive solutions to complex, customer driven problems with limited direction - develop requirements, propose ways forward when customer requirements are unclear or incomplete, and adapt appropriately to changes in requirements - Communicate effectively and openly with multi-disciplinary program teams, senior management, and sponsors - Track record of leading teams of 3 or more people to accomplish program goals, developing time/budgetary estimates, and mentoring junior engineers - Strong organization, planning and time management skills to achieve program goals Qualifications:

Required Qualifications: - Bachelor of Science degree with 7+ years of experience in a relevant field such as mechanical engineering, materials science, or manufacturing engineering - <OR> Master of Science degree with 5+ years of experience in a relevant field such as mechanical engineering, materials science, or manufacturing engineering - Team player able to work in a fast-paced environment with demonstrated ability to handle multiple competing tasks and demands - Experience with materials, fabrication, and assembly techniques associated with printed circuit assemblies including surface mount technology, high density substrates, rigid-flex designs, and integrated circuit assembly -

Experience designing/directing the physical layout of electrical circuits including SMD, interconnect definition, and integrated circuit assembly techniques - die level experience. Experience designing in 3D CAD using SolidWorks and/or CREO

Preferred Qualifications: - Experience with analysis tools such as ANSYS, COMSOL, and/or MatLab - Familiarity with machine shop tools and processes, prototyping, and vendor coordination - Experience writing proposals, executing feasibility studies, and generating ROM estimates of system performance/size, weight, power/cost with imperfect or incomplete information

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